Electronic Packaging
This one-day seminar on the electronic packaging aspects of
EMC is intended for mechanical and electronic packaging engineers.
Emphasis is on proper shielding and enclosure design. In addition,
the subjects of cabling, cable shielding, and electrostatic discharge protection
are discussed. This seminar duplicates some material found in the
Shielding and ESD Protection in Equipment Design seminars.
Although primarily intended for mechanical engineers;
electrical engineers, technical managers, and technicians who want a better
understanding of electronic packaging have also found this material to
be useful.
Outline
SHIELDING
Shielding Basics
Shielding Effectiveness
-Absorption Loss
-Reflection Loss
Seams, Holes & Apertures
Surface Finishes for Metals
Screens & Meshes
Waveguides Below Cutoff
Conductive Coatings for Plastics
Measuring Shielding Effectiveness
Selective Shielding
Power Line Filter Mounting & Grounding
Grounding of Shields
CABLE PENETRATIONS
Cable Treatment Guidelines
Cable Shield Terminations
Enclosure Voltages
Diagnostic Techniques
Connector Mounting & Grounding
Image Planes
ELECTROSTATIC DISCHARGE CONSIDERATIONS
Human Body Model
Protection Methods
Metallic Enclosures
– Secondary Arcs
– Circuit/Enclosure Bonding
Interface Cable Treatment
– Shielding
– Transient Suppression
Plastic Enclosures
– Treatment of I/O Ports
– Seam Design
Arcing Distances
Control Panels/Keyboards
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Henry Ott Consultants
48 Baker Road Livingston, NJ 07039
Phone: 973-992-1793, FAX: 973-533-1442
e-mail: h.ott@att.net
June 26, 2001